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(Nov. 20, 2014) The New System on a Chip (SoC) Technology that Captures 3D Images with a Single Came
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2016-02-13 01:38:01
The New System on a Chip (SoC) Technology that Captures 3D Images with a Single Camera

A system on semiconductor (SoC) enabling 3D photographing with a camera will be released. 
A system semiconductor specialist eWBM (CEO: Oh Sang-geun) announced on the 19th that it had concluded a patent license contract with Dual Aperture (DA), which holds source technologies, earlier this year. The company also announced that it had recently completed development of a SoC ‘DR1151’ and that it would showcase a prototype at the end of next month. (rest omitted)  see more


SOURCE Electronic Times
http://english.etnews.com/news/article.html?id=20141120200002
 
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